A device that is attached to a microprocessor chip to keep it from overheating by absorbing its heat and dissipating it into the air. Generally, a microprocessor's temperature should not run in excess of 50-55 degrees Celsius while under a full load.
Is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal grease improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of copper and/or aluminium. Copper is used because it has many desirable properties for thermally efficient and durable heat exchangers. First and foremost, copper is an excellent conductor of heat. This means that copper's high thermal conductivity allows heat to pass through it quickly.
- 3 x heat sink for raspberry pi 3 b microprocessor
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